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2017 18th International Conference on Electronic Packaging Technology (ICEPT) ,
1
The study on elastic properties of Cu3Sn under pressure via..:
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2017 18th International Conference on Electronic Packaging Technology (ICEPT) ,
2
The electronic properties of zinc-blende GaN, wurtzite GaN ..:
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Proceedings of the 29th ACM International Conference on Information & Knowledge Management ,
9