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2024 International Conference on Electronics Packaging (ICEP) ,
2
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:
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2024 International Conference on Electronics Packaging (ICEP) ,
4
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:
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2024 International Conference on Electronics Packaging (ICEP) ,
7
In-situ observations of CU6Sn5 mophological changes at the ..:
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The Minerals, Metals & Materials Series; Light Metals 2023 ,
9
Fluidity and Microstructural Analysis of Al–Ni Alloys with ..:
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2023 International Conference on Electronics Packaging (ICEP) ,
10
Evolution of the Sn-Bi Solder Microstructure vs. Temperatur..:
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2023 International Conference on Electronics Packaging (ICEP) ,
14