Noma, Hirokazu
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1

Optimization of Core Material Properties for Large Flip-chi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Noma, Hirokazu ; Takahashi, Masaki ; Hatakeyama, Nene... - p. 1613-1618 , 2024
 
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2

High Frequency Characteristics of Fine Copper Lines on High..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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Fine Copper Lines with High Adhesion on High Rigidity Diele..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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5

Peripheral Flip Chip Interconnection on Au Plated Pads usin..:

Noma, Hirokazu ; Toriyama, Kazushige ; Okamoto, Keishi...
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 95-100 , 2011
 
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6

Micro Structure Observation and Reliability Behavior of Per..:

Orii, Yasumitsu ; Toriyama, Kazushige ; Kohara, Sayuri...
Transactions of The Japan Institute of Electronics Packaging.  4 (2011)  1 - p. 73-86 , 2011
 
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7

Wettability and Reliability for Double-Sided Assembly with ..:

Noma, Hirokazu ; Oyama, Yukifumi ; Nishiwaki, Hidetoshi...
Transactions of The Japan Institute of Electronics Packaging.  2 (2009)  1 - p. 85-90 , 2009
 
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9

Effect of Impurity at SiO2/Si Interface on 2D Hole Gas:

Fujioka, Hiroshi ; Noma, Hirokazu ; Ono, Kanta.
Japanese Journal of Applied Physics.  39 (2000)  7S - p. 4657 , 2000
 
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15

Neutralizing Type I Interferon Autoantibodies in Japanese P..:

Eto, Shohei ; Nukui, Yoko ; Tsumura, Miyuki...
Journal of Clinical Immunology.  42 (2022)  7 - p. 1360-1370 , 2022
 
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