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1

Measurement of Aluminium Remnant Thickness on Copper Wire B..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),

Supramaniam, Saraswathy ; Periasamy, Subashini ; Nurhisham, Muhammad.. - p. 1-6 , 2023

Link: https://doi.org/10.1109/..

2

Design and simulation of a rooftop PV System in Taylor's Un..:

Krishna, Y ; Fauzan, M F ; Muhammad Nurhisham Gan, N B
Journal of Physics: Conference Series. 2120 (2021) 1 - p. 012035 , 2021

Link: https://doi.org/10.1088/..

3

Acceptance Criteria for Good Solder Joint Reliability On Wa..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Periasamy, Subashini ; Supramaniam, Saraswathy ; Bin Abdullah, Muhammad Nurhisham. - p. 910-917 , 2023

Link: https://doi.org/10.1109/..

4

Package Fault Isolation for Low Density and Non-Metallic Pa..:

, In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT),

Supramaniam, Saraswathy ; Bin Abdullah, Muhammad Nurhisham ; Periasamyline, Subashini - p. 1-7 , 2022

Link: https://doi.org/10.1109/..

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