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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
5
Block level and package level thermal assessment for back s..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
6
Experimentally Validated Thermal Modeling Prediction for BE..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
7
Thermal Performance Evaluation of Multi-Core SOCs Using Pow..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
12
Towards accurate temperature prediction in BEOL for reliabi..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
13
Towards Chip-Package-System Co-optimization of Thermally-li..:
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
15