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Oi, Kiyoshi
24  results:
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1

Study on thermal stress behavior of mold type POL tile:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
Murayama, Kei ; Tajima, Kiyoko ; Kobayashi, Mikiko... - p. 1161-1166 , 2023
Link: https://doi.org/10.1109/..
 
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2

Inductive Sintering Module for Improved Multi-Die Attach in..:

, In: 2023 IEEE CPMT Symposium Japan (ICSJ),
Hofmann, Christian ; Rochala, Patrick ; Kroll, Martin... - p. 137-140 , 2023
Link: https://doi.org/10.1109/..
 
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3

Influence of micro voids in flip chip bump on electro-migra..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Murayama, Kei ; Oon Lee, Kor ; Ono, Toshiaki... - p. 1144-1152 , 2022
Link: https://doi.org/10.1109/..
 
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4

The Effects of Voids on Solder Joint Reliability in First L..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lim, Sze Pei ; Lee, Kor Oon ; Oi, Kiyoshi... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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5

POL tile as a small package for a power module:

, In: 2022 IEEE Applied Power Electronics Conference and Exposition (APEC),
Murayama, Kei ; Kaneko, Amane ; Aizawa, Mitsuhiro.. - p. 1672-1677 , 2022
Link: https://doi.org/10.1109/..
 
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6

Voids in First-Level Interconnects and Their Impact on Sold..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Kor Oon ; Oi, Kiyoshi ; Lim, Sze Pei... - p. 5-6 , 2022
Link: https://doi.org/10.23919..
 
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7

Development of High Reliability Joint of Sn-Bi Solder for 2..:

, In: 2021 International Conference on Electronics Packaging (ICEP),
Miki, Shota ; Kawakami, Koyuki ; Murayama, Kei. - p. 91-92 , 2021
Link: https://doi.org/10.23919..
 
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8

Electro-migration evaluation between organic interposer and..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Murayama, Kei ; Miki, Shota ; Sugahara, Hiromi. - p. 716-722 , 2020
Link: https://doi.org/10.1109/..
 
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9

Thermal Characteristic Evaluation of Silver and Copper Sint..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Murayama, Kei ; Ota, Hiroko ; Oi, Kiyoshi - p. 300-304 , 2019
Link: https://doi.org/10.1109/..
 
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10

Klinefelter's Syndrome Accompanied by Mixed Connective Tiss..:

TAKEUCHI, Yoko ; MURATA, Yoshiharu ; SINTANI, Junko...
Internal Medicine.  38 (1999)  11 - p. 875-881 , 1999
Link: https://doi.org/10.2169/..
 
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11

Direct Cu-Cu bonding by low-temperature sintering using thr..:

Arai, Susumu ; Nakajima, Soichiro ; Shimizu, Masahiro...
Materials Today Communications.  35 (2023)  - p. 105790 , 2023
Link: https://doi.org/10.1016/..
 
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12

Randomized Multicenter Clinical Trial Comparing 0.1% Brimon..:

Inatani, Masaru ; Orii, Yusuke ; Iwasaki, Kentaro...
Advances in Therapy.  40 (2023)  9 - p. 4074-4092 , 2023
Link: https://doi.org/10.1007/..
 
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13

Association of Serum Oxysterols with Cholesterol Metabolism..:

Akiyama, Yusuke ; Katsuki, Shunsuke ; Matoba, Tetsuya...
Nutrients.  15 (2023)  13 - p. 2997 , 2023
Link: https://doi.org/10.3390/..
 
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14

Association between Serum Oxysterols and Coronary Plaque Re..:

Nakano, Yasuhiro ; Yamamoto, Mitsutaka ; Matoba, Tetsuya...
Journal of Atherosclerosis and Thrombosis.  30 (2023)  8 - p. 907-918 , 2023
Link: https://doi.org/10.5551/..
 
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15

Mid-term results of mitral valve reconstruction with autolo..:

Kinoshita, Ryoji ; Arai, Hirokuni ; Yashima, Masafumi...
General Thoracic and Cardiovascular Surgery.  70 (2022)  8 - p. 694-704 , 2022
Link: https://doi.org/10.1007/..
 
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