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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:
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2024 International Conference on Electronics Packaging (ICEP) ,
9
Surface Modification by Wet Treatment for Low-Temperature C..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
10
Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:
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2023 International Conference on Electronics Packaging (ICEP) ,
12
Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
14