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Ong, Xuefen
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Design, assembly and reliability of large die and fine-pitc..:

Ong, Yue Ying ; Ho, Soon Wee ; Vaidyanathan, Kripesh...
Microelectronics Reliability.  50 (2010)  7 - p. 986-994 , 2010
Link: https://doi.org/10.1016/..
 
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Underfill selection methodology for fine pitch Cu/low-k FCB..:

Ong, Xuefen ; Ho, Soon Wee ; Ong, Yue Ying...
Microelectronics Reliability.  49 (2009)  2 - p. 150-162 , 2009
Link: https://doi.org/10.1016/..
 
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A Systematic Underfill Selection Methodology for Fine Pitch..:

, In: 2007 9th Electronics Packaging Technology Conference,
Ong, Xuefen ; Sohn, Dong Kyun ; Hsia, Liang Choo... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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