Oon Lee, Kor
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1

Influence of micro voids in flip chip bump on electro-migra..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Murayama, Kei ; Oon Lee, Kor ; Ono, Toshiaki... - p. 1144-1152 , 2022
 
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2

Optimization of fins used in electronic packaging:

Eu Ong, Kang ; Oon Lee, Kor ; Seetharamu, K.N....
Microelectronics International.  22 (2005)  1 - p. 10-15 , 2005
 
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3

Adhesion Characterization of Redistribution Layer:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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4

Voids in First-Level Interconnects and Their Impact on Sold..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Kor Oon ; Oi, Kiyoshi ; Lim, Sze Pei... - p. 5-6 , 2022
 
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5

The Effects of Voids on Solder Joint Reliability in First L..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Lim, Sze Pei ; Lee, Kor Oon ; Oi, Kiyoshi... - p. 1-4 , 2022
 
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10

Infection prevention and control practices in long-term res..:

Lai, Claudia KY ; Leung, Audrey PY ; Lee, Rainbow LP...
Asian Journal of Gerontology and Geriatrics.  16 (2021)  1 - p. 5-12 , 2021
 
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11

PD-0941 Feasibility of prostatic calcifications tracking us..:

leung, W.K. ; Pang, E.P.P. ; Cheung, S.K.T....
Radiotherapy and Oncology.  161 (2021)  - p. S783-S784 , 2021
 
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