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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Influence of micro voids in flip chip bump on electro-migra..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Adhesion Characterization of Redistribution Layer:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Voids in First-Level Interconnects and Their Impact on Sold..:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
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