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Ostaszewski, Dariusz
7  results:
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1

A Wire-Bonded Patch Antenna for Millimeter Wave Application:

Bogdan, Grzegorz ; Sobolewski, Jakub ; Bajurko, Paweł...
Electronics.  12 (2023)  3 - p. 632 , 2023
Link: https://doi.org/10.3390/..
 
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2

Correction: Technology of Standard SMT Components Embedded ..:

Stęplewski, Wojciech ; Rybak, Andrzej ; Dziedzic, Andrzej...
Journal of Electronic Materials.  52 (2023)  7 - p. 5036-5036 , 2023
Link: https://doi.org/10.1007/..
 
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3

Technology of Standard SMT Components Embedded Into PCB by ..:

Stęplewski, Wojciech ; Rybak, Andrzej ; Dziedzic, Andrzej...
Journal of Electronic Materials.  , 2023
Link: https://doi.org/10.1007/..
 
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4

Interconnect Stress Testing as a Tool for Assessment of Rel..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Koscielski, Marek ; Glinski, Krzysztof ; Ostaszewski, Dariusz... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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5

Evaluation of new technologies and materials for printed ci..:

Baszynski, Michal ; Ramotowski, Edward ; Ostaszewski, Dariusz...
Circuit World.  42 (2016)  1 - p. 32-36 , 2016
Link: https://doi.org/10.1108/..
 
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6

A Wire-Bonded Patch Antenna for Millimeter Wave Application:

Grzegorz Bogdan ; Jakub Sobolewski ; Paweł Bajurko...
Networks.  , 2023
Link: https://doi.org/10.3390/..
 
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7

A Wire-Bonded Patch Antenna for Millimeter Wave Application:

Grzegorz Bogdan ; Jakub Sobolewski ; Paweł Bajurko...
https://www.mdpi.com/2079-9292/12/3/632.  , 2023
Link: https://doi.org/10.3390/..
 
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