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2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) ,
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Glass as A Functional Material for Micro Electromechanical ..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Processing Glass Substrate for Advanced Packaging using Las..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Glass Wafer Level Packaging Enabled by Laser Induced Deep E..:
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Materialbearbeitung mit ultrakurzen Laserpulsen unter Verwe..
MALDEAN - hochpräzise Ultrakurzpulslaser : Abschlussberich...