Ostmann, A.
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9

Manufacturing of high frequency substrates as software prog..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Manessis, D. ; Seckel, M. ; Fu, L.... - p. 1-7 , 2020
 
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10

Embedding Technologies for the Manufacturing of Advanced Mi..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Manessis, D. ; Schischke, K. ; Pawlikowski, J.... - p. 1-8 , 2019
 
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11

High Frequency Substrate Technologies for the Realisation o..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Manessis, D. ; Seckel, M. ; Fu, L.... - p. 1-7 , 2019
 
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12

Reliability of Substrate Embedded Rectifiers for High Volta..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Meier, K. ; Meyer, J. ; Schein, F.-L.... - p. 276-281 , 2019
 
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14

Low-temperature contacts through SixNy-antireflection coati..:

Wünsch, F. ; Klein, D. ; Podlasly, A....
Solar Energy Materials and Solar Cells.  93 (2009)  6-7 - p. 1024-1028 , 2009
 
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15

Morphology and growth kinetics of intermetallic compounds i..:

Huang, M. L. ; Loeher, T. ; Manessis, D....
Journal of Electronic Materials.  35 (2006)  1 - p. 181-188 , 2006
 
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