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Ouyang, Keqing
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1

Utilizing Macroscopic Polarization for Effective Fe3+/Fe2+ ..:

Tu, Shuchen ; Hao, Tianyang ; Li, Xiangming...
ACS ES&T Engineering.  4 (2024)  7 - p. 1573-1584 , 2024
Link: https://doi.org/10.1021/..
 
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2

A Modularized Thermal Test Chip Design and Verification:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Sun, Jianjun ; Wang, Deping ; Zhou, Shiying... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Mirroring ATPG Technology for Multi-Core Chips:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Ouyang, Keqing ; Peng, Minqiang ; Zhou, Jitong.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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4

A Closed-Loop Chip Fast Binning Technology:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Peng, Minqiang ; Ouyang, Keqing ; Wang, Jiawei... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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5

Comparison of Simulation and Test Results of Multi-Type Rin..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Chen, Kuili ; Wang, Jian ; Wang, Haiyong.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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6

Analysis and Protection Solution for Aging DC-Stress Induce..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wang, Haiyon ; Wei, Qi ; Liu, Jinxin... - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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7

A Dynamic Reusable Structure of I/O Pads for Scan Chains:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Peng, Minqiang ; Ouyang, Keqing ; Cheng, Qi.. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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8

A crosstalk mitigation method of DDR5 in large size LGA pac..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Ouyang, Keqing ; Ma, Shineng ; Wu, Feng... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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9

A Novel Method to Achieve High Efficient Iteration of MBIST..:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Peng, Minqiang ; Ouyang, Keqing ; Pan, Feilong.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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10

Thermal Resistance Simulation Analysis and Test Research of..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Qu, Fang ; Yan, Bin ; Wang, Zongwei... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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11

Solution to Optimize Warpage performance for 2.5D Fanout Pa..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Jiang, Yue ; Chen, Yang ; Hu, Fengtian... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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12

An Efficient External Memory Test Solution: Case Study for ..:

, In: 2023 IEEE 41st VLSI Test Symposium (VTS),
Ouyang, Keqing ; Peng, Minqiang ; Zhu, Yunnong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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13

An Efficient ATPG Technology Based On Time Division Multipl..:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Peng, Minqiang ; Ouyang, Keqing ; Zhou, Lunmao. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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14

A 26-GHz Linear Power Amplifier with 20.8-dBm OP1dB Support..:

, In: 2023 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Chen, Zhilin ; Wang, Xiyu ; Ma, Xiaoxiao... - p. 193-196 , 2023
Link: https://doi.org/10.1109/..
 
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15

A Methdology for Testing Scan Chain with Diagnostic Enhance..:

, In: 2023 China Semiconductor Technology International Conference (CSTIC),
Ouyang, Keqing ; Peng, Minqiang ; Wang, Shuai.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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