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Packwood, Matt
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Structure Function Assisted Thermal Coupling Analysis for P..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Pottage, Daniel ; Li, Xiang ; Packwood, Matt.. - p. 1-4 , 2020
Link: https://doi.org/10.1109/..
 
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