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Proceedings of the 28th Asia and South Pacific Design Automation Conference ,
1
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
2
Thermal Characteristics of Integrated Fan-Out on Substrate ..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
3
Temperature-to-Power Mapping for Smartphones:
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Proceedings of the 24th Asia and South Pacific Design Automation Conference ,
4
Phone-nomenon : a system-level thermal simulator for han..:
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
5
Leakage-Aware Dynamic Compact Thermal Model for CMOS Techno..:
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