Panigrahi, Asisa Kumar
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1

TCAD Analysis of Substrate Thickness of a 10nm Vertical Dou..:

, In: 2023 5th International Conference on Smart Systems and Inventive Technology (ICSSIT),
 
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2

Fabrication of On-Silicon Aperture Coupled Patch Antenna Th..:

Bonam, Satish ; Joseph, Jose ; Hemanth Kumar, C....
IEEE Transactions on Semiconductor Manufacturing.  35 (2022)  4 - p. 626-632 , 2022
 
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3

TCAD Simulation of a 10nm n-Channel Vertical Double Gate Si..:

, In: 2022 13th International Conference on Computing Communication and Networking Technologies (ICCCNT),
 
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4

Achieving of Intensified Conductive Interconnections for Fl..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
 
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5

Metal-Alloy Cu Surface Passivation Leads to High Quality Fi..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
 
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10

Optimized ultra-thin manganin alloy passivated fine-pitch d..:

Panigrahi, Asisa Kumar ; Kumar, C. Hemanth ; Bonam, Satish...
Japanese Journal of Applied Physics.  57 (2017)  2S1 - p. 02BC04 , 2017
 
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11

Nonlithographic Fabrication of Plastic-Based Nanofibers Int..:

K, Brince Paul ; Panigrahi, Asisa Kumar ; Singh, Vikrant.
ACS Applied Materials & Interfaces.  9 (2017)  46 - p. 39994-40005 , 2017
 
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14

Improved noise coupling performance using optimized Teflon ..:

, In: 2016 IEEE International 3D Systems Integration Conference (3DIC),
 
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