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2023 5th International Conference on Smart Systems and Inventive Technology (ICSSIT) ,
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TCAD Analysis of Substrate Thickness of a 10nm Vertical Dou..:
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2022 13th International Conference on Computing Communication and Networking Technologies (ICCCNT) ,
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TCAD Simulation of a 10nm n-Channel Vertical Double Gate Si..:
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
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Achieving of Intensified Conductive Interconnections for Fl..:
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2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
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Metal-Alloy Cu Surface Passivation Leads to High Quality Fi..:
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2016 IEEE International 3D Systems Integration Conference (3DIC) ,
14