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Pantano, Nicolas
25  results:
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1

Impact of Pitch Scaling on 3D Die-to-Die Interconnects:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Pantano, Nicolas ; Stucchi, Michele ; Van der Plas, Geert. - p. 1064-1071 , 2024
Link: https://doi.org/10.1109/..
 
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2

A 32 Gb/s Full duplex Bi-directional Transceiver with Cross..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Park, Jae-Woo ; Pantano, Nicolas ; Van Der Plas, Geert.. - p. 1072-1077 , 2024
Link: https://doi.org/10.1109/..
 
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3

Analysis and Application of a Surface Admittance Operator f..:

Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniël...
IEEE Transactions on Microwave Theory and Techniques.  71 (2023)  7 - p. 2794-2806 , 2023
Link: https://doi.org/10.1109/..
 
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4

ESD mitigation for 3D IC hybrid bonding:

, In: 2023 45th Annual EOS/ESD Symposium (EOS/ESD),
Lin, Shih-Hsiang ; Simicic, Marko ; Pantano, Nicolas... - p. 1-9 , 2023
Link: https://doi.org/10.23919..
 
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5

Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Pinho, Nelson ; Chery, Emmanuel ; Pantano, Nicolas... - p. 1364-1368 , 2023
Link: https://doi.org/10.1109/..
 
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6

Highly Optimized O-band Si Ring Modulators for Low-Power Hy..:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
Ban, Yoojin ; Kim, Minkyu ; De Heyn, Peter... - p. 1-3 , 2023
Link: https://doi.org/10.1364/..
 
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7

Efficient Characterization of Interconnects With Arbitrary ..:

Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniël...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  10 - p. 1567-1575 , 2023
Link: https://doi.org/10.1109/..
 
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8

Interconnect Modeling using a Surface Admittance Operator D..:

, In: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS),
Bosman, Dries ; Huynen, Martijn ; De Zutter, Daniel... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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9

Broadband Characterization of Polymers under Reliability St..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Pantano, Nicolas ; Chery, Emmanuel ; De Beeck, Maaike Op.. - p. 1218-1223 , 2022
Link: https://doi.org/10.1109/..
 
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10

Tbps/mm bandwidth for chip-to-chip communication using fine..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Pantano, Nicolas ; Slabbekoorn, John ; Van Der Plas, Geert. - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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11

Apoyo y soporte en la elaboración de los avalúos comerciale..:

Pantano Carrillo, Brandon Nicolás
http://hdl.handle.net/11349/16306.  , 2019
Link: http://hdl.handle.net/11..
 
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12

Reduced Tau protein expression is associated with frontotem..:

Papegaey, Anthony ; Eddarkaoui, Sabiha ; Deramecourt, Vincent...
Acta Neuropathologica Communications.  4 (2016)  1 - p. , 2016
Link: https://doi.org/10.1186/..
 
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13

Reduced Tau protein expression is associated with frontotem..:

Papegaey, Anthony ; Eddarkaoui, Sabiha ; Deramecourt, Vincent...
http://www.actaneurocomms.org/content/4/1/74.  , 2016
Link: http://www.actaneurocomm..
 
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14

Reduced Tau protein expression is associated with frontotem..:

Papegaey, Anthony ; Eddarkaoui, Sabiha ; Deramecourt, Vincent...
info:eu-repo/semantics/altIdentifier/doi/10.1186/s40478-016-0345-0.  , 2015
Link: https://www.hal.inserm.f..
 
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15

Reduced Tau protein expression is associated with frontotem..:

Papegaey, Anthony ; Eddarkaoui, Sabiha ; Deramecourt, Vincent...
info:eu-repo/semantics/altIdentifier/doi/10.1186/s40478-016-0345-0.  , 2015
Link: https://inserm.hal.scien..
 
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