Park, Dongwoon
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5

In Situ Thickness Measurements of a Silicon Wafer with a De..:

Park, Dong-Woon ; Oh, Gyung-Hwan ; Kim, Heon-Su...
Journal of Infrared, Millimeter, and Terahertz Waves.  44 (2023)  5-6 - p. 458-472 , 2023
 
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6

Effect of cure shrinkage of epoxy molding compound on warpa..:

Baek, Jeong-Hyeon ; Park, Dong-Woon ; Oh, Gyung-Hwan...
Materials Science in Semiconductor Processing.  148 (2022)  - p. 106758 , 2022
 
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7

Influence of Pad Design on Assembly Reliability of Surface ..:

Park, Dong-Woon ; Yu, Myeong-Hyeon ; Kim, Do-Hyung...
International Journal of Precision Engineering and Manufacturing-Green Technology.  , 2022
 
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