Park, Jee-Ho
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2

A 0.0308mm2 4.15pJ/conv VCO-Based Current Sensing Front-End..:

, In: 2022 IEEE Asian Solid-State Circuits Conference (A-SSCC),
 
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3

A CMOS Microelectrode Array System With Reconfigurable Sub-..:

Cha, Ji-Hyoung ; Park, Jee-Ho ; Park, Yongjae...
IEEE Transactions on Biomedical Circuits and Systems.  16 (2022)  6 - p. 1044-1056 , 2022
 
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4

A 3.8-µW 1.5-NEF 15-GΩ Total Input Impedance Chopper Stabil..:

Park, Yongjae ; Cha, Ji-Hyoung ; Han, Su-Hyun..
IEEE Journal of Solid-State Circuits.  57 (2022)  8 - p. 2449-2461 , 2022
 
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A BJT-Based Temperature-to-Frequency Converter With ± 1°C (..:

Park, Jee-Ho ; Hwang, Jung-Hye ; Shin, Changyong.
IEEE Journal of Solid-State Circuits.  57 (2022)  10 - p. 2909-2918 , 2022
 
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8

A 45 nm RFSOI CMOS-based 24.25-29.5 GHz 2×16-Channel Phased..:

, In: 2024 IEEE Radio Frequency Integrated Circuits Symposium (RFIC),
Lee, Jooseok ; Baek, Seungjae ; Kim, Kihyun... - p. 47-50 , 2024
 
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A Reconfigurable Sub-Array Multiplexing Microelectrode Arra..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Cha, Ji-Hyoung ; Park, Jee - Ho ; Park, Yongjae... - p. 342-344 , 2022
 
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10

Correlation between spin density and Vth instability of IGZ..:

Park, Jee Ho ; Lee, Sohyung ; Lee, Hee Sung...
Current Applied Physics.  18 (2018)  11 - p. 1447-1450 , 2018
 
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11

Adopting Novel Strategies in Achieving High-Performance Sin..:

Park, Ji-Hyeon ; Park, Jee Ho ; Biswas, Pranab...
ACS Applied Materials & Interfaces.  8 (2016)  18 - p. 11564-11574 , 2016
 
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12

Surface-tension-tailored aqueous ink for low-temperature de..:

Han, Sun Woong ; Lee, Keun Ho ; Yoo, Young Bum...
Japanese Journal of Applied Physics.  55 (2016)  8 - p. 080310 , 2016
 
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13

Microscale Soft Patterning for Solution Processable Metal O..:

Jung, Sang Wook ; Chae, Soo Sang ; Park, Jee Ho...
ACS Applied Materials & Interfaces.  8 (2016)  11 - p. 7205-7211 , 2016
 
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15

Solution-processed laminated ZrO2/Al2O3 dielectric for low-..:

Han, Sun Woong ; Park, Jee Ho ; Yoo, Young Bum...
Journal of Sol-Gel Science and Technology.  81 (2016)  2 - p. 570-575 , 2016
 
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