Park, Jongcheol
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2

Signal Integrity Analysis of Through-Silicon-Via (TSV) With..:

Kim, Hyunwoong ; Park, Jongcheol ; Lee, Sanguk..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  12 - p. 1973-1988 , 2023
 
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3

A Compact Cold Atom Gravimeter Utilizing a Grating Magneto ..:

, In: 2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
Seo, Sangwon ; Lee, Jae Hoon ; Lee, Sang-Bum... - p. 1-1 , 2023
 
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6

Signal Integrity Analysis of Through-Silicon Via (TSV) With..:

Kim, Hyunwoong ; Lee, Seonghi ; Park, Jongcheol...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  5 - p. 700-714 , 2023
 
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12

An Empirical Study on Process Management System using YOLO-..:

Park, Jongcheol ; Jang, Wonho ; Yoo, Namhyun
Journal of Physics: Conference Series.  1888 (2021)  1 - p. 012024 , 2021
 
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