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Proceedings of the 29th ACM SIGPLAN Annual Symposium on Principles and Practice of Parallel Programming ,
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Locks as a Resource: Fairly Scheduling Lock Occupation with..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
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FEA-based Layout Optimization of E1.S Solid-State Drive to ..:
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2023 IEEE International Conference on Consumer Electronics (ICCE) ,
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An Efficient F2FS GC Scheme for Improving I/O Latency of Fo..:
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2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) ,
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Imitation Learning-based Equalizer Design Optimization Meth..:
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2023 IEEE International Reliability Physics Symposium (IRPS) ,
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Analysis of SSD Acoustic Noise Generation Mechanism dependi..:
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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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PCB-level Jitter Sensitivity Measurement and Hierarchical P..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
10
TC Reliability Enhancement Technology for SSD with Low Temp..:
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Proceedings of the 14th ACM Workshop on Hot Topics in Storage and File Systems ,
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File fragmentation from the perspective of I/O control:
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Proceedings of the 14th ACM Workshop on Hot Topics in Storage and File Systems ,
14
When F2FS meets address remapping:
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2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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