Park, Sunggook
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Extending Copper Interconnects and Epoxy Dielectrics to Mul..:

Park, Junghyun ; Xu, Jiayou ; Engler, Anthony...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  6 - p. 984-992 , 2024
 
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Modifying surface charge density of thermoplastic nanofluid..:

Jia, Zheng ; Choi, Junseo ; Lee, Sunggun..
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  648 (2022)  - p. 129147 , 2022
 
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