Pei, Zhenlin
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2

Emerging Interconnect Exploration for SRAM Application Usin..:

, In: 2023 24th International Symposium on Quality Electronic Design (ISQED),
 
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A Technology/Circuit Co-design Framework for Emerging Recon..:

, In: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS),
Lu, Sheng ; Pei, Zhenlin ; Shang, Liuting.. - p. 1123-1127 , 2023
 
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Graphene-Based Interconnect Exploration for Large SRAM Cach..:

Pei, Zhenlin ; Mayahinia, Mahta ; Liu, Hsiao-Hsuan...
IEEE Transactions on Electron Devices.  70 (2023)  1 - p. 230-238 , 2023
 
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Technology/Memory Co-Design and Co-Optimization Using E-Tre..:

, In: Proceedings of the Great Lakes Symposium on VLSI 2023,
Pei, Zhenlin ; Mayahinia, Mahta ; Liu, Hsiao-Hsuan... - p. 159-162 , 2023
 
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CFET SRAM With Double-Sided Interconnect Design and DTCO Be..:

Liu, Hsiao-Hsuan ; Schuddinck, Pieter ; Pei, Zhenlin...
IEEE Transactions on Electron Devices.  70 (2023)  10 - p. 5099-5106 , 2023
 
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Beyond-Cu Intermediate-Length Interconnect Exploration for ..:

Pei, Zhenlin ; Catthoor, Francky ; Tokei, Zsolt.
IEEE Transactions on Nanotechnology.  21 (2022)  - p. 367-373 , 2022
 
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Effects of BiNbO4 on the microstructure and dielectric prop..:

Yuan, Ying ; Du, Min ; Zhang, Shuren.
Journal of Materials Science: Materials in Electronics.  20 (2008)  2 - p. 157-162 , 2008
 
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Experimental investigations on visualization of three-dimen..:

Zhou, Huai-Chun ; Lou, Chun ; Cheng, Qiang...
Proceedings of the Combustion Institute.  30 (2005)  1 - p. 1699-1706 , 2005
 
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Subcutaneously Engineered Decalcified Bone Matrix Xenograft..:

Pan, Qingqing ; Zhang, Pei ; Xue, Fei...
ACS Biomaterials Science & Engineering.  10 (2023)  1 - p. 515-524 , 2023
 
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