Peng, Chia-Yu
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2

Characterization of Low Loss Dielectric Materials for High-..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lee, Tzu Nien ; Lau, John H ; Ko, Cheng-Ta... - p. 2222-2229 , 2022
 
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3

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
 
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4

Fan-In Panel-Level with Multiple Diced Wafers Packaging:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Tseng, Tzvy-Jang... - p. 1146-1153 , 2020
 
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5

A Novel Warpage Reinforcement Architecture with RDL Interpo..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Peng, Chia-Yu ; Lin, Puru Bruce ; Ko, Cheng-Ta... - p. 526-531 , 2020
 
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6

A study of the competitive multiple hydrogen bonding effect..:

Chen, Yi-Ting ; Wu, Pei-Jhen ; Peng, Chia-Yu...
Physical Chemistry Chemical Physics.  19 (2017)  42 - p. 28641-28646 , 2017
 
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7

Optically Triggered Stepwise Double-Proton Transfer in an I..:

Peng, Chia-Yu ; Shen, Jiun-Yi ; Chen, Yi-Ting...
Journal of the American Chemical Society.  137 (2015)  45 - p. 14349-14357 , 2015
 
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9

Soyasaponin I decreases the expression of α2,3-linked siali..:

Chang, Wei-Wei ; Yu, Chia-Yu ; Lin, Tzu-Wen..
Biochemical and Biophysical Research Communications.  341 (2006)  2 - p. 614-619 , 2006
 
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10

High-Density Hybrid Substrate for Heterogeneous Integration:

Peng, Tony Chia-Yu ; Lau, John H. ; Ko, Cheng-Ta...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  3 - p. 469-478 , 2022
 
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11

Nickel-Catalyzed Suzuki–Miyaura Coupling in Water for the S..:

Yu, Yu-Chen ; Sung, Yun-Chiao ; Fu, Jun-Hao...
The Journal of Organic Chemistry.  89 (2024)  4 - p. 2448-2458 , 2024
 
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