Peng, Yarui
134  results:
Search for persons X
?
 
?
2

Factoring Interacting Stress Mechanisms in Design for Relia..:

Huitink, David ; Vinson, Whit ; Ruby, Collin...
Journal of Microelectronics and Electronic Packaging.  20 (2023)  4 - p. , 2023
 
?
4

PowerSynth 2: Physical Design Automation for High-Density 3..:

Al Razi, Imam ; Le, Quang ; Evans, Tristan M...
IEEE Transactions on Power Electronics.  38 (2023)  4 - p. 4698-4713 , 2023
 
?
 
?
6

Electromigration-Aware Reliability Optimization of MCPM Lay..:

, In: 2022 IEEE Energy Conversion Congress and Exposition (ECCE),
 
?
8

Thermal Runaway Mitigation through Electrothermal Constrain..:

, In: 2022 IEEE Design Methodologies Conference (DMC),
 
?
9

Cross-Boundary Inductive Timing Optimization for 2.5D Chipl..:

, In: Proceedings of the 2021 Great Lakes Symposium on VLSI,
 
?
10

Physical Design Automation for High-Density 3D Power Module..:

, In: 2020 IEEE Energy Conversion Congress and Exposition (ECCE),
Razi, Imam Al ; Le, Quang ; Mantooth, H. Alan. - p. 1984-1991 , 2020
 
?
 
?
12

PowerSynth progression on layout optimization for reliabili..:

Peng, Yarui ; Le, Quang ; Razi, Imam Al...
Nonlinear Theory and Its Applications, IEICE.  11 (2020)  2 - p. 124-144 , 2020
 
?
13

Coupling extraction and optimization for heterogeneous 2.5D..:

, In: Proceedings of the 39th International Conference on Computer-Aided Design,
 
?
14

Electronic Design Automation (EDA) Tools and Considerations..:

, In: 2020 IEEE Energy Conversion Congress and Exposition (ECCE),
Evans, Tristan M. ; Mukherjee, Shilpi ; Peng, Yarui. - p. 5046-5052 , 2020
 
1-15