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Pentapati, Sai
38  results:
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1

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

Huang, Yen-Hsiang ; Pentapati, Sai ; Agnesina, Anthony..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  , 2024
Link: https://doi.org/10.1109/..
 
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2

Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA So..:

Pentapati, Sai ; Lim, Sung-Kyu
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  32 (2024)  3 - p. 413-421 , 2024
Link: https://doi.org/10.1109/..
 
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3

Pin-3D: Effective Physical Design Methodology for Multidie ..:

Pentapati, Sai ; Chang, Kyungwook ; Lim, Sung Kyu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  4 - p. 1009-1022 , 2024
Link: https://doi.org/10.1109/..
 
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4

Snap-3D: A Constrained Placement-Driven Physical Design Met..:

Vanna-Iampikul, Pruek ; Shao, Chengjia ; Lu, Yi-Chen...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  42 (2023)  7 - p. 2331-2335 , 2023
Link: https://doi.org/10.1109/..
 
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5

ECO-GNN: Signoff Power Prediction Using Graph Neural Networ..:

Lu, Yi-Chen ; Nath, Siddhartha ; Pentapati, Sai.
ACM Transactions on Design Automation of Electronic Systems.  28 (2023)  4 - p. 1-22 , 2023
Link: https://doi.org/10.1145/..
 
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6

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Pentapati, Sai ; Agnesina, Anthony ; Brunion, Moritz.. - p. 62-70 , 2023
Link: https://dl.acm.org/doi/1..
 
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7

A Machine Learning-Powered Tier Partitioning Methodology fo..:

Lu, Yi-Chen ; Pentapati, Sai ; Zhu, Lingjun...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  11 - p. 4575-4586 , 2022
Link: https://doi.org/10.1109/..
 
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8

Metal Layer Sharing: A Routing Optimization Technique for M..:

Pentapati, Sai ; Lim, Sung Kyu
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  30 (2022)  9 - p. 1355-1367 , 2022
Link: https://doi.org/10.1109/..
 
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9

Routing Layer Sharing : A New Opportunity for Routing Op..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Pentapati, Sai ; Lim, Sung Kyu - p. 127-134 , 2022
Link: https://dl.acm.org/doi/1..
 
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10

The Law of Attraction : Affinity-Aware Placement Optimiz..:

, In: Proceedings of the 2021 International Symposium on Physical Design,
Lu, Yi-Chen ; Pentapati, Sai ; Lim, Sung Kyu - p. 7-14 , 2021
Link: https://dl.acm.org/doi/1..
 
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11

Snap-3D: A Constrained Placement-Driven Physical Design Met..:

, In: Proceedings of the 2021 International Symposium on Physical Design,
Vanna-Iampikul, Pruek ; Shao, Chengjia ; Lu, Yi-Chen.. - p. 39-46 , 2021
Link: https://dl.acm.org/doi/1..
 
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12

Machine Learning Integrated Pseudo-3-D Flow for Monolithic ..:

Pentapati, Sai ; Ku, Bon Woong ; Lim, Sungkyu
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits.  7 (2021)  1 - p. 35-42 , 2021
Link: https://doi.org/10.1109/..
 
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13

Macro-3D : a physical design methodology for face-to-fac..:

, In: Proceedings of the 23rd Conference on Design, Automation and Test in Europe,
Bamberg, Lennart ; García-Ortiz, Alberto ; Zhu, Lingjun... - p. 37-42 , 2020
Link: https://dl.acm.org/doi/1..
 
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14

Macro-3D: A Physical Design Methodology for Face-to-Face-St..:

, In: 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Bamberg, Lennart ; Garcia-Ortiz, Alberto ; Zhu, Lingjun... - p. 37-42 , 2020
Link: https://doi.org/10.23919..
 
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15

A Logic-on-Memory Processor-System Design With Monolithic 3..:

Pentapati, Sai ; Zhu, Lingjun ; Bamberg, Lennart...
IEEE Micro.  39 (2019)  6 - p. 38-45 , 2019
Link: https://doi.org/10.1109/..
 
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