Petzold, Matthias
323  results:
Search for persons X
?
2

Influence of Copper Wire Material Additive Elements to the ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Klengel, Robert ; Klengel, Sandy ; Schischka, Jan... - p. 774-781 , 2020
 
?
3

How Copper Wire Material Additive Elements Effect the Relia..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
 
?
4

Influence of copper wire material to corrosion resistant pa..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
?
5

Investigation of mechanical and microstructural properties ..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
 
?
8

Interfacial void segregation of Cl in Cu-Sn micro-connects:

Ross, Glenn ; Tao, Xiaoma ; Broas, Mikael...
Electronic Materials Letters.  13 (2017)  4 - p. 307-312 , 2017
 
?
9

Editorial: ESREF 2016:

Petzold, Matthias
Microelectronics Reliability.  64 (2016)  - p. 1 , 2016
 
?
12

Modellierung der Stressempfindlichkeit von Halbleiterbauele.. 

Schlussbericht der Forschungsstellen Nr. 1, Albert-Ludwigs-... 
 
?
13

Zur Bedeutung der Familie:

, In: Handbuch Pädagogik der frühen Kindheit.,
Petzold, Matthias - p. 55-65 , 2013
 
1-15