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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Influence of Copper Wire Material Additive Elements to the ..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
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How Copper Wire Material Additive Elements Effect the Relia..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Influence of copper wire material to corrosion resistant pa..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
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Investigation of mechanical and microstructural properties ..:
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Modellierung der Stressempfindlichkeit von Halbleiterbauele..
Schlussbericht der Forschungsstellen Nr. 1, Albert-Ludwigs-...