Pey, Kin Leong
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1

A New Methodology to Precisely Induce Wake-Up for Reliabili..:

, In: 2023 IEEE International Reliability Physics Symposium (IRPS),
Tan, Tiang Teck ; Wang, Yu-Yun ; Tan, Joel... - p. 1-7 , 2023
 
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2

Molecular Bridges Link Monolayers of Hexagonal Boron Nitrid..:

Ranjan, Alok ; O'Shea, Sean J. ; Padovani, Andrea...
ACS Applied Electronic Materials.  5 (2023)  2 - p. 1262-1276 , 2023
 
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3

Impact of Voltage Polarity on Time-Dependent Dielectric Bre..:

Tan, Joel ; Lim, Jia Hao ; Sikder, Bejoy...
IEEE Transactions on Electron Devices.  70 (2023)  1 - p. 76-82 , 2023
 
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4

Adhesion Microscopy as a Nanoscale Probe for Oxidation and ..:

Ranjan, Alok ; Padovani, Andrea ; Dianat, Behnood...
ACS Applied Electronic Materials.  5 (2023)  9 - p. 5176-5186 , 2023
 
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5

Thermal simulations of lock-in-thermography for failure ana..:

, In: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Qiu, Wen ; Zee, Bernice ; Pey, Kin Leong. - p. 1-6 , 2023
 
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6

Reliability Analysis of Random Telegraph Noisebased True Ra..:

, In: 2023 IEEE International Integrated Reliability Workshop (IIRW),
 
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7

Experimental and Theoretical Investigation of Intracell Mag..:

Dutta, Ramit ; Hamid, Shafin Bin ; Lim, Jia Hao...
IEEE Transactions on Electron Devices.  70 (2023)  10 - p. 5428-5434 , 2023
 
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9

Electrical Stress Induced Breakdown and Post Breakdown Phys..:

, In: 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC),
Maruvada, Anirudh ; O'Shea, Sean J. ; Deng, Jie... - p. 452-456 , 2023
 
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15

Dielectric Breakdown in Single-Crystal Hexagonal Boron Nitr..:

Ranjan, Alok ; Raghavan, Nagarajan ; Holwill, Matthew...
ACS Applied Electronic Materials.  3 (2021)  8 - p. 3547-3554 , 2021
 
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