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Phommahaxay, Alain
31  results:
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1

IR Laser Release for 3D Stacked Devices: Effect of the Rele..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chancerel, Francois ; Urban, Peter ; Slabbekoorn, John... - p. 343-347 , 2024
Link: https://doi.org/10.1109/..
 
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2

Multi-tier die stacking through collective die-to-wafer hyb..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Lin, Ye ; Suhard, Samuel... - p. 637-642 , 2024
Link: https://doi.org/10.1109/..
 
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3

Collective die-to-wafer assembly process for optically inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Dvoretskii, Anton ; Podpod, Arnita... - p. 1392-1397 , 2024
Link: https://doi.org/10.1109/..
 
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4

Process Challenges During CVD Oxide Deposition on the Backs..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Guerrero, Alice ; Salahouelhadj, Abdellah... - p. 1584-1589 , 2023
Link: https://doi.org/10.1109/..
 
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5

Overview of scalable transfer approaches to enable epitaxia..:

, In: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT),
Brems, Steven ; Ghosh, Souvik ; Smets, Quentin... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
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6

Detection of bonding voids in multi-tier stacks with scanni..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Cong ; Slabbekoorn, John ; Bogdanowicz, Janusz... - p. 320-325 , 2023
Link: https://doi.org/10.1109/..
 
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7

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; D'have, Koen ; Okudur, Oguzhan Orkut... - p. 1410-1417 , 2023
Link: https://doi.org/10.1109/..
 
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8

Direct Bonding Using Low Temperature SiCN Dielectrics:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; Nagano, Fuya ; Channam, Venkat Sunil Kumar... - p. 602-607 , 2022
Link: https://doi.org/10.1109/..
 
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9

Application of the surface planer process to Cu pillars and..:

Inoue, Fumihiro ; Phommahaxay, Alain ; Gokita, Yohei..
The International Journal of Advanced Manufacturing Technology.  119 (2022)  5-6 - p. 3427-3435 , 2022
Link: https://doi.org/10.1007/..
 
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10

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
Link: https://doi.org/10.1109/..
 
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11

Carrier Systems for Collective Die-to-Wafer Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Phommahaxay, Alain ; Guerrero, Alice... - p. 2058-2063 , 2022
Link: https://doi.org/10.1109/..
 
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12

Demonstration of a collective hybrid die-to-wafer integrati..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Suhard, Samuel ; Phommahaxay, Alain ; Kennes, Koen... - p. 1315-1321 , 2020
Link: https://doi.org/10.1109/..
 
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13

Introduction of a New Carrier System for Collective Die-to-..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Phommahaxay, Alain ; Guerrero, Alice... - p. 296-302 , 2020
Link: https://doi.org/10.1109/..
 
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14

Characterization of Silicon Carbon Nitride for Low Temperat..:

Nagano, Fuya ; Iacovo, Serena ; Phommahaxay, Alain...
ECS Transactions.  98 (2020)  4 - p. 21-31 , 2020
Link: https://doi.org/10.1149/..
 
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15

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Capuz, Giovanni ; Cherman, Vladimir... - p. 617-622 , 2020
Link: https://doi.org/10.1109/..
 
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