Pierre, Vernhes
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1

Addressing sub-micron thermal warpage: Industrial applicati..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Safia, Benkoula ; Pierre, Vernhes ; Nicolas, Choisel... - p. 169-174 , 2023
 
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2

Deformation analysis of QFN packages for validation of ther..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
 
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4

Experimental Study of Panel Level Packaging Warpage:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Ecoiffier, Diane ; Vernhes, Pierre ; Ooi, R.C.... - p. 1-4 , 2020
 
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5

Effect of calendering on paper surface micro-structure: A m..:

Vernhes, Pierre ; Bloch, Jean-Francis. ; Blayo, Anne.
Journal of Materials Processing Technology.  209 (2009)  11 - p. 5204-5210 , 2009
 
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8

Collaboration entre médecins généralistes et psychologues e..:

Vergès, Yohann ; Vernhes, Stéphanie ; Vanneste, Patrick...
Annales Médico-psychologiques, revue psychiatrique.  179 (2021)  8 - p. 757-767 , 2021
 
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9

The generation of reactive-oxygen species associated with l..:

Bonnafous, Pierre ; Vernhes, Marie-Christine ; Teissié, Justin.
Biochimica et Biophysica Acta (BBA) - Biomembranes.  1461 (1999)  1 - p. 123-134 , 1999
 
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11

Gilets Jaunes 

Anatomie einer ungewöhnlichen sozialen Bewegung  Neue kleine Bibliothek ; 274
Copies:  Zentrale:E02 a sow 537 3na/089
 
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