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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
Addressing sub-micron thermal warpage: Industrial applicati..:
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
2
Deformation analysis of QFN packages for validation of ther..:
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2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) ,
4
Experimental Study of Panel Level Packaging Warpage:
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11
Gilets Jaunes
Anatomie einer ungewöhnlichen sozialen Bewegung
Neue kleine Bibliothek ; 274
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Zentrale:E02 a sow 537 3na/089