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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bondin:
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2023 IEEE 3rd International Conference on Software Engineering and Artificial Intelligence (SEAI) ,
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AyatDroid: A Lightweight Code Cloning Technique Using Diffe..:
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2022 3rd Asia Conference on Computers and Communications (ACCC) ,
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AASH: A Lightweight and Efficient Static IoT Malware Detect..:
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2022 3rd Asia Conference on Computers and Communications (ACCC) ,
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