Po-Kai, Chiu
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1

Thermal Design of SiC Power Module for EV/HEV Applications:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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2

The Development of 1.7kV 100A SiC MOSFET Power Module for A..:

, In: 2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia),
 
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4

Welded microstructure and orientation variation of duplex T..:

Liu, Chia-Heng ; Kuo, Chen-Kuan ; Wang, Shing-Hoa...
Journal of Materials Research and Technology.  21 (2022)  - p. 519-531 , 2022
 
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5

Welded microstructure and orientation variation of duplex T..:

Chia-Heng Liu ; Chen-Kuan Kuo ; Shing-Hoa Wang...
http://www.sciencedirect.com/science/article/pii/S2238785422014478.  , 2022
 
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7

Onset of hard magnetic MnGa thin film on glass substrate:

Chang, Cheng-Wei ; Shieh, Jiann-Shing ; Hermosa, Glemarie C....
Journal of Magnetism and Magnetic Materials.  524 (2021)  - p. 167668 , 2021
 
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8

Microstructural Characterization and Mechanical Properties ..:

Wang, Shing-Hoa ; Hsiao, Wuan-Yun ; Yang, Yo-Lun...
Journal of Materials Engineering and Performance.  30 (2021)  11 - p. 8169-8177 , 2021
 
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10

Assessment of Frying Oil Degradation using Laser Direct Wri..:

, In: 2020 IEEE International Instrumentation and Measurement Technology Conference (I2MTC),
 
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12

Double-Sided Cooling SiC Power Module Packaging for Industr..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liu, Chun-Kai ; Wu, Sheng-Tsai ; Lo, Yuan-Yin... - p. 105-108 , 2020
 
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