E-LIB Suche - Ergebnisse für: Po-Yu Wang

1

High Speed Signal Design on Fan-Out RDL Interposer for Arti..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Zhuang, Ming-Han ; Shih, Chih-Yuan ; Lin, Ho-Chuan.. - p. 275-276 , 2024

2

Effect of expelling P content on Ni(P) dissolution and reac..:

Hsu, Ya-Hui ; Lo, Mei-Hsin ; Lee, Yu-Chun...
Journal of Materials Science: Materials in Electronics. 35 (2024) 10 - p. , 2024

Link: https://doi.org/10.1007/..

3

Fan-Out Embedded Bridge Structure for CoPackaged Optics Cha..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Lin, Vito ; Shih, Teny ; Kang, Andrew. - p. 1246-1250 , 2024

Link: https://doi.org/10.1109/..

4

Investigation of Blind MicroVias Bonding Force: A Field Stu..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Chen, Hung-Kun ; Chan, Shun-Jen ; Pai, Yu-Cheng.. - p. 141-142 , 2024

Link: https://doi.org/10.23919..

5

FCCSP Warpage Scope Evaluation for 5G Product with Advanced..:

, In: 2024 47th International Spring Seminar on Electronics Technology (ISSE),

Zeng, Tzu-Chi ; Lin, Vito ; Shih, Teny. - p. 1-4 , 2024

Link: https://doi.org/10.1109/..

6

Underfill Selection Guideline for Fan-Out Heterogeneous Int..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Teng, Wen-Yu ; Hung, Liang-Yih ; Lee, Jackson... - p. 1993-1997 , 2024

Link: https://doi.org/10.1109/..

7

Non-invasive Glucose Extraction by a Single Polarization Ro..:

Lo, Yu-Lung ; Chen, Yi-Sheng ; Wang, Po-Yu...
Biomedical Optics Express. , 2024

Link: https://doi.org/10.1364/..

8

Advanced TIM Material Analysis for High Performance Package..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Jhan, Jyun-De ; Teng, Wen-Yu ; Hung, Liang-Yih.. - p. 229-230 , 2024

Link: https://doi.org/10.23919..

9

Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Li, Jay ; Zhang, Zen-Wei ; Lin, Vito... - p. 2107-2111 , 2024

Link: https://doi.org/10.1109/..

10

Study of Galvanic Effect Factor and Mechanism for Ni/Au Pla..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

He, MJ ; Ye, Rick ; Pai, Yu Cheng. - p. 143-144 , 2024

Link: https://doi.org/10.23919..

11

Correction: Play, Learn, and Teach Outdoors — Network (PLaT..:

Lee, Eun-Young ; de Lannoy, Louise ; Li, Lucy...
International Journal of Behavioral Nutrition and Physical Activity. 20 (2023) 1 - p. , 2023

Link: https://doi.org/10.1186/..

12

Tree-Based Machine Learning Models with Optuna in Predictin..:

Lai, Jung-Pin ; Lin, Ying-Lei ; Lin, Ho-Chuan...
Micromachines. 14 (2023) 2 - p. 265 , 2023

Link: https://doi.org/10.3390/..

13

Investigation of Solder Resist Opening Uniformity on Flip C..:

, In: 2023 International Conference on Electronics Packaging (ICEP),

Ni, Yuan-Chang ; Teng, Wen-Yu ; Pai, Yu-Cheng.. - p. 255-256 , 2023

Link: https://doi.org/10.23919..

14

Antenna-in-Package Electrical Research for Beyond 5G applic..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Lai, Chia-Chu ; Lin, Sam ; Shih, Teny.. - p. 63-66 , 2023

Link: https://doi.org/10.1109/..

15

AC Noise Enhancement with Fan-out Embedded Bride Package So..:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Kao, Feng ; Wang, David ; Shih, Teny. - p. 195-198 , 2023

Link: https://doi.org/10.1109/..