Polomoff, Nicholas
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Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
 
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3

High Speed SPM Applied for Direct Nanoscale Mapping of the ..:

Huey, Bryan D. ; Nath Premnath, Ramesh ; Lee, Sungjun..
Journal of the American Ceramic Society.  95 (2012)  4 - p. 1147-1162 , 2012
 
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