Prasad, Gangavarapu Krishna
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1

Low‐temperature curable adhesive for joining SiC/SiC compon..:

Thuniki, Naveen Reddy ; Gangavarapu, Krishna Prasad ; Brijendra, Vikram G...
International Journal of Applied Ceramic Technology.  21 (2023)  3 - p. 2531-2540 , 2023
 
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2

Decontamination of Chemical Warfare Agents (Review Article):

Singh, Beer ; Prasad, Gangavarapu Krishna ; Pandey, K.S..
https://publications.drdo.gov.in/ojs/index.php/dsj/article/view/487/245.  , 2010
 
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6

5G and IoT Cloud Integration for Enhancing Connectivity and..:

, In: 2024 5th International Conference on Intelligent Communication Technologies and Virtual Mobile Networks (ICICV),
 
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10

Lead Toxicity: Health Hazards, Influence on Food Chain, and..:

Kumar, Amit ; Kumar, Amit ; M.M.S., Cabral-Pinto...
International Journal of Environmental Research and Public Health.  17 (2020)  7 - p. 2179 , 2020
 
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11

Trends in Primary Anatomical Single-Bundle Anterior Cruciat..:

Pandey, Vivek ; Madi, Sandesh ; Thonse, Chirag...
Indian Journal of Orthopaedics.  56 (2022)  10 - p. 1703-1716 , 2022
 
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12

A Unique Extensible Framework Detection and Classification ..:

, In: Advances in Power Systems and Energy Management; Lecture Notes in Electrical Engineering,
 
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