E-LIB Suche - Ergebnisse für: Radu, Ionut

1

Tailored Polycrystalline Substrate for SmartSiCTM Substrate..:

Biard, Hugo ; Odoul, Sidoine ; Schwarzenbach, Walter...
Solid State Phenomena. 344 (2023) - p. 47-52 , 2023

Link: https://doi.org/10.4028/..

2

Improved performance of FDSOI FETs at cryogenic temperature..:

Han, Yi ; Sun, Jingxuan ; Radu, Ionut...
Solid-State Electronics. 208 (2023) - p. 108733 , 2023

Link: https://doi.org/10.1016/..

3

150 mm SiC Engineered Substrates for High-Voltage Power Dev..:

Rouchier, Séverin ; Gaudin, Gweltaz ; Widiez, Julie...
Materials Science Forum. 1062 (2022) - p. 131-135 , 2022

Link: https://doi.org/10.4028/..

4

Characterization of fully silicided source/drain SOI UTBB n..:

Han, Yi ; Xi, Fengben ; Allibert, Frederic...
Solid-State Electronics. 192 (2022) - p. 108263 , 2022

Link: https://doi.org/10.1016/..

5

Large‐Diameter III–V on Si Substrates by the Smart Cut Proc..:

Ghyselen, Bruno ; Navone, Christelle ; Martinez, Muriel...
physica status solidi (a). 219 (2022) 4 - p. , 2022

Link: https://doi.org/10.1002/..

6

Multi-Gate FD-SOI Single Electron Transistor for hybrid SET..:

, In: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC),

Bersano, Fabio ; De Palma, Franco ; Oppliger, Fabian... - p. 49-52 , 2022

Link: https://doi.org/10.1109/..

7

Large‐Diameter III–V on Si Substrates by the Smart Cut Proc..:

Ghyselen, Bruno ; Navone, Christelle ; Martinez, Muriel...
physica status solidi (a). 219 (2021) 4 - p. , 2021

Link: https://doi.org/10.1002/..

8

An agile and scalable manufacturing model to support 5G gro..:

, In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),

Andia, Luis ; Mazure, Carlos ; Radu, Ionut. - p. 1-3 , 2020

Link: https://doi.org/10.1109/..

9

Low temperature junctionless device stacking enabled by lea..:

, In: 2019 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA),

Besnard, Guillaume ; Gaudin, Gweltaz ; Schwarzenbach, Walter... - p. 1-2 , 2019

Link: https://doi.org/10.1109/..

10

InGaAs-OI Substrate Fabrication on a 300 mm Wafer:

Sollier, Sebastien ; Widiez, Julie ; Gaudin, Gweltaz...
Journal of Low Power Electronics and Applications. 6 (2016) 4 - p. 19 , 2016

Link: https://doi.org/10.3390/..

11

Physical and Electrical Properties of Thin Doped Silicon Fi..:

Gaudin, Gweltaz ; Van Den Daele, William ; Chartrain, Nicholas...
ECS Journal of Solid State Science and Technology. 2 (2013) 12 - p. P534-P538 , 2013

Link: https://doi.org/10.1149/..

12

(Invited) Direct Bonding Energy in Anhydrous Atmosphere:

Fournel, Frank ; Continni, Léonardo ; Morales, Christophe...
ECS Transactions. 50 (2013) 7 - p. 3-16 , 2013

Link: https://doi.org/10.1149/..

13

(Invited) Low Temperature Direct Bonding 3D Stacking Techno..:

Di Cioccio, Lea ; Radu, Ionut ; Gaudin, Gweltaz...
ECS Transactions. 58 (2013) 9 - p. 17-28 , 2013

Link: https://doi.org/10.1149/..

14

Treatments of Deposited SiOx Surfaces Enabling Low Temperat..:

Rauer, Caroline ; Moriceau, H. ; Fournel, Frank...
ECS Transactions. 50 (2013) 7 - p. 287-295 , 2013

Link: https://doi.org/10.1149/..

15

Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Dir..:

Di Cioccio, Lea ; Radu, Ionut ; Baudin, Floriane...
ECS Transactions. 50 (2013) 7 - p. 169-175 , 2013

Link: https://doi.org/10.1149/..