E-LIB Suche - Ergebnisse für: Rajendran, Sri Harini

1

Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil in..:

Rajendran, Sri Harini ; Lee, Gyeong Ah ; Park, Jin Yong..
Materials Chemistry and Physics. 313 (2024) - p. 128732 , 2024

Link: https://doi.org/10.1016/..

2

Eutectic Bonding in Sequential Bi and Sn Layers for Low-Tem..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Rajendran, Sri Harini ; Jung, Jae Pil ; Jung, Chul Hwa. - p. 277-278 , 2024

Link: https://doi.org/10.23919..

3

Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints fo..:

Rajendran, Sri Harini ; Ku, Jun Ho ; Kang, Jiwan.
Materials Today Communications. 38 (2024) - p. 108250 , 2024

Link: https://doi.org/10.1016/..

4

Microstructure and Mechanical Properties of Type 8 Solder P..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Ku, Jun Ho ; Rajendran, Sri Harini ; Jung, Jae Pil - p. 309-310 , 2024

Link: https://doi.org/10.23919..

5

Recent Advances in High Entropy Alloy Fillers for Brazing S..:

Khan, Furkan ; Rajendran, Sri Harini ; Jung, Jae Pil
Metals and Materials International. 30 (2023) 5 - p. 1145-1169 , 2023

Link: https://doi.org/10.1007/..

6

Effect of 0D and 1D ZnO nano additive reinforced Sn-3.0Ag-0..:

Rajendran, Sri Harini ; Seo, Seong Min ; Jung, Jae Pil
Materials Today Communications. 35 (2023) - p. 105795 , 2023

Link: https://doi.org/10.1016/..

7

Investigating the physical, mechanical, and reliability stu..:

Rajendran, Sri Harini ; Jung, Do Hyun ; Jung, Jae Pil
Journal of Materials Science: Materials in Electronics. 33 (2022) 7 - p. 3687-3710 , 2022

Link: https://doi.org/10.1007/..

8

Comparative study on the wettability and thermal aging char..:

Rajendran, Sri Harini ; Cho, Do Hoon ; Jung, Jae Pil
Materials Today Communications. 31 (2022) - p. 103814 , 2022

Link: https://doi.org/10.1016/..

9

Correction to: Investigating the physical, mechanical, and ..:

Rajendran, Sri Harini ; Jung, Do Hyun ; Jung, Jae Pil
Journal of Materials Science: Materials in Electronics. 33 (2022) 14 - p. 11624-11624 , 2022

Link: https://doi.org/10.1007/..

10

Ultrasonic dispersion of nanocomposite solder for microelec..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),

Rajendran, Sri Harini ; Kang, Hyejun ; Seo, Seong Min. - p. 1-4 , 2022

Link: https://doi.org/10.1109/..

11

A Review on the Fabrication and Reliability of Three-Dimens..:

Cho, Do Hoon ; Seo, Seong Min ; Kim, Jang Baeg..
Metals. 11 (2021) 10 - p. 1664 , 2021

Link: https://doi.org/10.3390/..

12

Active Brazing of Alumina and Copper with Multicomponent Ag..:

Rajendran, Sri Harini ; Hwang, Seung Jun ; Jung, Jae Pil
Metals. 11 (2021) 3 - p. 509 , 2021

Link: https://doi.org/10.3390/..

13

Low Melting Temperature Sn-Bi Solder: Effect of Alloying an..:

Kang, Hyejun ; Rajendran, Sri Harini ; Jung, Jae Pil
Metals. 11 (2021) 2 - p. 364 , 2021

Link: https://doi.org/10.3390/..

14

Three-Dimesnional Semicondoctor Stacking using TSV(Through-..:

Cho, Do Hoon ; Kang, Hye Jun ; Seo, Seong Min...
Journal of Welding and Joining. 39 (2021) 3 - p. 295-303 , 2021

Link: https://doi.org/10.5781/..

15

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-B..:

Rajendran, Sri Harini ; Kang, Hyejun ; Jung, Jae Pil
Journal of Materials Engineering and Performance. 30 (2021) 5 - p. 3167-3172 , 2021

Link: https://doi.org/10.1007/..