Raju, Salahuddin
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1

Low-Loss RF Passive Elements by Top-Metal Air-Gap Technolog:

, In: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Prawoto, Clarissa ; Ma, Zichao ; Xiao, Ying... - p. 47-49 , 2022
 
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2

Bayesian Deep Active Learning for Analog Circuit Performanc..:

, In: 2022 IEEE International Symposium on Circuits and Systems (ISCAS),
Zhang, Lining ; Raju, Salahuddin ; James, Ashish... - p. 3018-3022 , 2022
 
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3

Hollow Airgap Technology for CMOS Maximum Interconnect Capa..:

, In: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT),
Prawoto, Clarissa ; Ma, Zichao ; Xiao, Ying.. - p. 1-4 , 2022
 
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4

Analysis of the Wave Modes for Super-High Frequency SAW Dev..:

, In: 2022 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS),
 
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5

Automated Deep Learning Platform for Accelerated Analog Cir..:

, In: 2022 IEEE 35th International System-on-Chip Conference (SOCC),
 
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6

Thin-Film Magnetic Inductors on Silicon for Integrated Powe..:

, In: IECON 2020 The 46th Annual Conference of the IEEE Industrial Electronics Society,
Raju, Salahuddin ; Soh, Serine ; Lulu, Peng... - p. 2292-2295 , 2020
 
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7

Thin-Film Magnetic Inductor Design Strategy for Integrated ..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
 
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8

High Frequency Monolithic Inductor with Air-Gaps:

, In: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Prawoto, Clarissa ; Ma, Zichao ; Xiao, Ying... - p. 1-4 , 2020
 
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9

Fan-Out Packaging with Thin-film Inductors:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Boon, Soh Siew ; Wee, Ho Soon ; Boon, Simon Lim Siak... - p. 449-452 , 2020
 
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10

Learning of Multi-Dimensional Analog Circuits Through Gener..:

, In: 2019 32nd IEEE International System-on-Chip Conference (SOCC),
Dutta, Rahul ; Raju, Salahuddin ; James, Ashish... - p. 394-399 , 2019
 
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11

A Physical Model for Thin-Film Magnetic Inductors:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
 
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12

A Self-Sustained Sensor Node through Far-Field Wireless Pow..:

, In: 2019 IEEE Asia-Pacific Microwave Conference (APMC),
Raju, Salahuddin ; Dan Lei, Yan ; Lih, Lim Wei... - p. 1604-1606 , 2019
 
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15

IEEE SSCS Hong Kong Chapter Winter 2017 Activities [Chapter..:

Raju, Salahuddin ; Yue, Patrick
IEEE Solid-State Circuits Magazine.  9 (2017)  2 - p. 49-51 , 2017
 
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