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Retnasamy, Vithyacharan
14
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Format
Online (14)
Mediatypes
Articles (Online) (11)
OpenAccess-fulltext (3)
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1
Effect of High Temperature during Electroless Nickel Proces:
Sauli, Zaliman
;
Retnasamy, Vithyacharan
;
Hashim, Uda
...
Advanced Materials Research. 925 (2014) - p. 88-91 , 2014
Link:
https://doi.org/10.4028/..
?
2
Surface Roughness Influence on O2 and Ar RIE Gas Treated Al..:
Sauli, Zaliman
;
Retnasamy, Vithyacharan
;
Hashim, Uda
...
Advanced Materials Research. 925 (2014) - p. 92-95 , 2014
Link:
https://doi.org/10.4028/..
?
3
Main Effects of Lattice Parameter in Ba0.65Sr0.35TiO3 Thin ..:
Sauli, Zaliman
;
Retnasamy, Vithyacharan
;
Palianysamy, Moganraj
...
Procedia - Social and Behavioral Sciences. 129 (2014) - p. 512-517 , 2014
Link:
https://doi.org/10.1016/..
?
4
Polymer Core BGA Stress Analysis at Higher Vertical Loading:
Sauli, Zaliman
;
Retnasamy, Vithyacharan
;
Vairavan, Rajendaran
..
Procedia - Social and Behavioral Sciences. 129 (2014) - p. 430-435 , 2014
Link:
https://doi.org/10.1016/..
?
5
Wire Bond Shear Test Simulation on Flat Surface Bond Pad:
Sauli, Zaliman
;
Retnasamy, Vithyacharan
;
Vairavan, Rajendaran
..
Procedia - Social and Behavioral Sciences. 129 (2014) - p. 328-333 , 2014
Link:
https://doi.org/10.1016/..
?
6
Wettability and Surface Roughness Study on RIE Treated Alum..:
Retnasamy, Vithyacharan
;
Sauli, Zaliman
;
Hashim, Uda
...
Advanced Materials Research. 925 (2014) - p. 101-104 , 2014
Link:
https://doi.org/10.4028/..
?
7
Chemical Bath Temperature Investigation for Electroless Nic..:
Retnasamy, Vithyacharan
;
Sauli, Zaliman
;
Hashim, Uda
...
Advanced Materials Research. 925 (2014) - p. 96-100 , 2014
Link:
https://doi.org/10.4028/..
?
8
Reactive Ion Etching Parameter Effect on Aluminum Bond Pad ..:
Palianysamy, Moganraj
;
Sauli, Zaliman
;
Hashim, Uda
...
Advanced Materials Research. 925 (2014) - p. 84-87 , 2014
Link:
https://doi.org/10.4028/..
?
9
Reactive Ion Etching Parameter Effect on Aluminum Bond Pad ..:
Palianysamy, Moganraj
;
Sauli, Zaliman
;
Hashim, Uda
...
Advanced Materials Research. 925 (2014) - p. 140-143 , 2014
Link:
https://doi.org/10.4028/..
?
10
Finite element analysis of thermal distributions of solder ..:
Boon Kar, Yap
;
Azrina Talik, Noor
;
Sauli, Zaliman
..
Microelectronics International. 30 (2013) 1 - p. 14-18 , 2013
Link:
https://doi.org/10.1108/..
?
11
Ionic contaminations level and cleaning flip chip BGA packa..:
Boon Kar, Yap
;
Azrina Talik, Noor
;
Sauli, Zaliman
...
Microelectronics International. 30 (2013) 2 - p. 99-103 , 2013
Link:
https://doi.org/10.1108/..
?
12
Digital fringe projection for hand surface coordinate varia..:
Wan Nor Haimi Wan Mokhdzani
;
Tan Cheek Hau
;
Retnasamy Vithyacharan
...
https://doi.org/10.1051/epjconf/201716201036. , 2017
Link:
https://doi.org/10.1051/..
?
13
Effects of air temperature and velocity on the drying kinet..:
Caparanga Alvin R
;
Reyes Rachael Anne L
;
Rivas Reiner L
...
https://doi.org/10.1051/epjconf/201716201084. , 2017
Link:
https://doi.org/10.1051/..
?
14
Critical analysis of stability and performance of organomet..:
Suhaimi Suriati
;
Sauli Zaliman
;
Ahmad Hambali Nor Azura Malini
...
https://doi.org/10.1051/epjconf/201716201043. , 2017
Link:
https://doi.org/10.1051/..
1-14