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2023 24th International Symposium on Quality Electronic Design (ISQED) ,
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Testbench on a Chip: A Yield Test Vehicle for Resistive Mem..:
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2023 Design, Automation & Test in Europe Conference & Exhibition (DATE) ,
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Ultra-Dense 3D Physical Design Unlocks New Architectural De..:
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ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC) ,
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EMBER: A 100 MHz, 0.86 mm2, Multiple-Bits-per-Cell RRAM Mac..:
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2023 60th ACM/IEEE Design Automation Conference (DAC) ,
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Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits:
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The Frontiers Collection; NANO-CHIPS 2030 ,
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Heterogeneous 3D Nano-systems: The N3XT Approach?:
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Kompendium Kulturmanagement / hrsg. von Armin Klein
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Zentrale:Magazin 03.h.1014; TB BHV: all 310/1(2)