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Roda Neve, C.
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1

Effect of temperature on advanced Si-based substrates perfo..:

Roda Neve, C. ; Ben Ali, K. ; Sarafis, P....
Microelectronic Engineering.  120 (2014)  - p. 205-209 , 2014
Link: https://doi.org/10.1016/..
 
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2

Advanced Si-based substrates for RF passive integration: Co..:

Sarafis, P. ; Hourdakis, E. ; Nassiopoulou, A.G....
Solid-State Electronics.  87 (2013)  - p. 27-33 , 2013
Link: https://doi.org/10.1016/..
 
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3

RF SOI CMOS technology on commercial trap-rich high resisti..:

, In: 2012 IEEE International SOI Conference (SOI),
Ben Ali, K. ; Roda Neve, C. ; Gharsallah, A.. - p. 1-2 , 2012
Link: https://doi.org/10.1109/..
 
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4

Impact of neutron irradiation on the RF properties of oxidi..:

Roda Neve, C. ; Kilchytska, V. ; Alvarado, J....
Microelectronics Reliability.  51 (2011)  2 - p. 326-331 , 2011
Link: https://doi.org/10.1016/..
 
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5

Behaviour of CPW and TFMS lines at high temperature for RF ..:

Roda Neve, C. ; Farcy, A. ; Gallitre, M....
Microelectronic Engineering.  87 (2010)  3 - p. 324-328 , 2010
Link: https://doi.org/10.1016/..
 
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6

Wide-Band Simulation and Characterization of Digital Substr..:

, In: 2007 IEEE International SOI Conference,
Bol, D. ; Ambroise, R. ; Roda Neve, C... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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7

Ultimate Layer Stacking Technology for High Density Sequent..:

, In: 2023 International Electron Devices Meeting (IEDM),
Radu, I. ; Nguyen, B-Y. ; Chang, C-H.... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Demonstration of 3D sequential FD-SOI on CMOS FinFET stacki..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Vandooren, A. ; Parihar, N. ; Franco, J.... - p. 330-331 , 2022
Link: https://doi.org/10.1109/..
 
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9

PPAC of sheet-based CFET configurations for 4 track design ..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Schuddinck, P. ; Bufler, F. M. ; Xiang, Y.... - p. 365-366 , 2022
Link: https://doi.org/10.1109/..
 
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10

A Simple and Efficient RF Technique for TSV Characterizatio:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Sun, X. ; Neve, C. Roda ; Van Huylenbroeck, S... - p. 1431-1436 , 2017
Link: https://doi.org/10.1109/..
 
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11

Contactless monitoring of Si substrate permittivity and res..:

Elhawil, A. ; Neve, C.Roda ; Olbrechts, B....
Microwave and Optical Technology Letters.  52 (2010)  11 - p. 2500-2505 , 2010
Link: https://doi.org/10.1002/..
 
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12

Surveying colloid sedimentation by coplanar waveguides:

Duţu, C A ; Vlad, A ; Roda-Neve, C...
Nanotechnology.  27 (2016)  22 - p. 225502 , 2016
Link: https://doi.org/10.1088/..
 
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13

Fast and accurate modelling of large TSV arrays in 3D-ICs u..:

Rack, Martin ; Ben Ali, K ; Raskin, Jean-Pierre...
boreal:241137.  , 2016
Link: http://hdl.handle.net/20..
 
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14

Investigation of TSV noise coupling in 3D-ICs using an expe..:

Rack, Martin ; Ben Ali, K ; Raskin, Jean-Pierre...
boreal:241132.  , 2016
Link: http://hdl.handle.net/20..
 
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15

Fast and accurate modelling of large TSV arrays in 3D-ICs u..:

Rack, Martin ; Ben Ali, K ; Raskin, Jean-Pierre...
boreal:241137.  , 2016
Link: http://hdl.handle.net/20..
 
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