Román, Antonio
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Low Resistance and High Isolation HD TSV for 3-Layer CMOS I..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Borel, Stephan ; Assous, Myriam ; Velard, Remi... - p. 771-777 , 2024
 
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3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With H..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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