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Roscain, Reinald John S.
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Epoxy Mold Compound Curing Behavior and Mold Process Cure T..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),
Garete, April Joy H. ; Fadullo, Marlon F. ; Roscain, Reinald John S. - p. 311-315 , 2019
Link: https://doi.org/10.1109/..
 
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