SAITO, Suguru
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1

Method to evaluate the adhesion distribution on wafers:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hiratsuka, Tatsumasa ; Hirano, Takaaki ; Kotoo, Kengo... - p. 1623-1627 , 2024
 
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2

Elucidating the mechanism of four corner voids in chip-on-w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

Testicular ACE regulates sperm metabolism and fertilization..:

Shibata, Tomohiro ; Bhat, Shabir A. ; Cao, DuoYao...
Journal of Biological Chemistry.  300 (2024)  1 - p. 105486 , 2024
 
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5

Analysis of vacancies in wafer-bonding interface via positr..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Saito, Sotetsu ; Fujii, Nobutoshi ; Furuse, Shunsuke... - p. 1916-1922 , 2024
 
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