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Saccon, Rodolfo
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1

Low cost copper based sintered interconnect material for op..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Bhogaraju, Sri Krishna ; Schmid, Maximilian ; Liu, E... - p. 1720-1725 , 2022
Link: https://doi.org/10.1109/..
 
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2

Effect of binders on the performance of copper sintering pa..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Saccon, Rodolfo ; Benin, Alice ; Bhogaraju, Sri Krishna. - p. 71-72 , 2022
Link: https://doi.org/10.23919..
 
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3

Formic acid and formate salts for chemical vapor deposition..:

Mokhtari, Omid ; Conti, Fosca ; Saccon, Rodolfo..
New Journal of Chemistry.  45 (2021)  43 - p. 20133-20139 , 2021
Link: https://doi.org/10.1039/..
 
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4

Copper sintering for microelectronics application:

Mohan, Nihesh ; Bhogaraju, Sri Krishna ; Saccon, Rodolfo.
https://opus4.kobv.de/opus4-haw-landshut/frontdoor/index/index/docId/368.  , 2022
Link: https://opus4.kobv.de/op..
 
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