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Sagong, Hyunchul
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1

Analysis of Failure Mechanism and Reliability Enhancement o..:

Sagong, Hyunchul ; Jeong, Seongcheol ; Lee, Hojoon
Sensors.  24 (2024)  3 - p. 975 , 2024
Link: https://doi.org/10.3390/..
 
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2

Systematic Study of Process Impact on FinFET Reliability:

, In: 2021 IEEE International Reliability Physics Symposium (IRPS),
Ranjan, Rakesh ; Lee, Ki-Don ; Mahmud, Md Iqbal... - p. 1-5 , 2021
Link: https://doi.org/10.1109/..
 
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3

Trap Density Modulation for IO FinFET NBTI Improvement:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Ranjan, Rakesh ; LaRow, Charles B. ; Lee, Ki-Don... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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4

Advanced Self-heating Model and Methodology for Layout Prox..:

, In: 2020 IEEE International Reliability Physics Symposium (IRPS),
Jiang, Hai ; Sagong, Hyunchul ; Kim, Jinju... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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5

FEOL Self-heating and BEOL Joule-heating Effects of FinFET ..:

, In: 2020 IEEE International Integrated Reliability Workshop (IIRW),
Jiang, Hai ; Jeong, Taeyoung ; Sagong, Hyunchul... - p. 1-5 , 2020
Link: https://doi.org/10.1109/..
 
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