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Analysis of vacancies in wafer-bonding interface via positr..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Saito, Sotetsu ; Fujii, Nobutoshi ; Furuse, Shunsuke... - p. 1916-1922 , 2024

Link: https://doi.org/10.1109/..

2

Influence of H2O in bonding interfaces on bonding strength ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),

Yoshioka, Hirotaka ; Fujii, Nobutoshi ; Shigetoshi, Takushi... - p. 1119-1123 , 2023

Link: https://doi.org/10.1109/..

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