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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Method to evaluate the adhesion distribution on wafers:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
9
Elucidating the mechanism of four corner voids in chip-on-w..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
10
Analysis of vacancies in wafer-bonding interface via positr..:
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2023 Nicograph International (NicoInt) ,
14