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Sakuma, Katsuyuki
58  results:
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1

A Microstructural Investigation of Sub-1 μm Copper Bonding ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Al Zerey, Sari ; Cho, Junghyun ; Yu, Roy. - p. 1306-1311 , 2024
Link: https://doi.org/10.1109/..
 
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2

Heterogeneous Integration on Organic Interposer Substrate w..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Bonilla, Griselda ; McHerron, Dale... - p. 872-877 , 2023
Link: https://doi.org/10.1109/..
 
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3

Voids-free Die-level Cu/ILD Hybrid bonding:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Polomoff, Nicholas... - p. 800-805 , 2023
Link: https://doi.org/10.1109/..
 
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4

A Methodology to Optimize Laser Dicing Parameters to Maximi..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Raghavan, Sathya ; Jain, Aakrati ; Chowdhury, Prabudhya Roy... - p. 139-146 , 2023
Link: https://doi.org/10.1109/..
 
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5

Thermal Characterization of 3-D Stacked Heterogeneous Integ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Jain, Aakrati ; Miyazawa, Risa ; Raghavan, Sathya... - p. 1219-1225 , 2023
Link: https://doi.org/10.1109/..
 
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6

Next Generation Infrared (IR) Laser Debonding / Silicon Han..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chen, Qianwen ; Belyansky, Michael ; Sulehria, Yasir... - p. 1175-1180 , 2023
Link: https://doi.org/10.1109/..
 
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7

Volume-controllable Solder Bumping Technology to Package Su..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Aoki, Toyohiro ; Sakuma, Katsuyuki ; Mori, Hiroyuki.. - p. 585-589 , 2023
Link: https://doi.org/10.1109/..
 
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8

Fabrication and Performance of 300-mm Wafer-Scale Silicon M..:

Colgan, Evan G. ; Schleupen, Kai ; Mann, Phillip...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  4 - p. 472-480 , 2023
Link: https://doi.org/10.1109/..
 
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9

Modeling of the Temperature Profile and Residual Stress Dur..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Chowdhury, Prabudhya Roy ; Raghavan, Sathya ; Darling, Luke... - p. 1418-1425 , 2023
Link: https://doi.org/10.1109/..
 
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10

Healthcare Wearable Sensors Adhesion to Human Fingernails a..:

Sakuma, Katsuyuki ; Pancoast, Leanna ; Yao, Yiping.
Micromachines.  15 (2023)  1 - p. 69 , 2023
Link: https://doi.org/10.3390/..
 
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11

Artificial Intelligence (AI) based methodology to minimize ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Raghavan, Sathya ; Mori, Hiroyuki ; Bonilla, Griselda. - p. 1213-1218 , 2023
Link: https://doi.org/10.1109/..
 
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12

Surface Energy Characterization for Die-Level Cu Hybrid Bon..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Sakuma, Katsuyuki ; Yu, Roy ; Belyansky, Michael... - p. 312-316 , 2022
Link: https://doi.org/10.1109/..
 
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13

Functional Testing of AI Cores through Thinned 3D I/O Buffe..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Farooq, Mukta ; Kumar, Arvind ; Lee, Sae-Kyu... - p. 977-980 , 2022
Link: https://doi.org/10.1109/..
 
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14

Thermo-mechanical Analysis of Thermal Compression Bonding C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Chowdhury, Prabudhya Roy ; Sakuma, Katsuyuki ; Raghavan, Sathya... - p. 579-585 , 2022
Link: https://doi.org/10.1109/..
 
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15

Back to Finger-Writing: Fingertip Writing Technology Based ..:

Blumrosen, Gaddi ; Sakuma, Katsuyuki ; Rice, John Jeremy.
IEEE Access.  8 (2020)  - p. 35455-35468 , 2020
Link: https://doi.org/10.1109/..
 
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Related subjects
Großintegration. LSI