Saligram, Rakshith
15  results:
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1

Cool-CIM: Cryogenic Operation of Analog Compute-In-Memory f..:

, In: 2023 International Electron Devices Meeting (IEDM),
 
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2

Design Exploration of 14 nm FinFET for Energy-Efficient Cry..:

Gaidhane, Amol D. ; Saligram, Rakshith ; Chakraborty, Wriddhi...
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits.  9 (2023)  2 - p. 108-115 , 2023
 
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3

Cryogenic CMOS as an Enabler for Low Power Dynamic Logic:

, In: 2023 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED),
 
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4

Design Space Exploration of Interconnect Materials for Cryo..:

Saligram, Rakshith ; Datta, Suman ; Raychowdhury, Arijit
IEEE Transactions on Circuits and Systems I: Regular Papers.  69 (2022)  11 - p. 4610-4618 , 2022
 
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5

Power Performance Analysis of Digital Standard Cells for 28..:

Saligram, Rakshith ; Chakraborty, Wriddhi ; Cao, Ningyuan...
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits.  7 (2021)  2 - p. 193-200 , 2021
 
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6

Characterization and Modeling of 22 nm FDSOI Cryogenic RF C..:

Chakraborty, Wriddhi ; Aabrar, Khandker Akif ; Gomez, Jorge...
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits.  7 (2021)  2 - p. 184-192 , 2021
 
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7

Multilevel Signaling for High-Speed Chiplet-to-Chiplet Comm..:

, In: VLSI-SoC: Design Trends; IFIP Advances in Information and Communication Technology,
 
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8

Pseudo-Static 1T Capacitorless DRAM using 22nm FDSOI for Cr..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chakraborty, Wriddhi ; Saligram, Rakshith ; Gupta, Aniket... - p. 40.1.1-40.1.4 , 2021
 
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9

A Model Study of Multilevel Signaling for High-Speed Chiple..:

, In: 2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC),
 
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